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EC9301H Datasheet(PDF) 13 Page - E-CMOS Corporation |
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EC9301H Datasheet(HTML) 13 Page - E-CMOS Corporation |
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13 / 14 page ![]() E-CMOS Corp. (www.ecmos.com.tw) Page 13 of 14 3L11N Rev. P001 3A 150KHz PWM Buck DC/DC Converter EC9301H Function Description(Cont.) noise of this circuit and improves efficiency. A ground plane is recommended to connect input capacitor, output capacitor, and GND pin of the EC9301H. In the EC9301H buck regulator circuit, the two major power dissipating components are the EC9301H and output inductor. The total power dissipation of converter circuit can be measured by input power minus output power. Ptotal _loss = V IN × IIN – V O × IO The power dissipation of inductor can be approximately calculated by output current and DCR of inductor. Pinductor _loss= IO 2 × Rinductor × 1.1 The junction to ambient temperature can be got from power dissipation in the EC9301H and thermal impedance from junction to ambient. T (jun-amb) =(Ptotalloss–Pinductorloss)× ΘJA The maximum junction temperature of EC9301H is 145°C, which limits the maximum load current capability. Please see the thermal de-rating curves for the maximum load current of the EC9301H under different ambient temperatures. The thermal performance of the EC9301H is trongly affected by the PCB layout. Extra care should be taken by users during the design process to nsure that the IC will operate under the recommended environmental conditions. Several layout tips are listed below for the best electric and thermal performance. 1. Do not use thermal relief connection to the VIN and the GND pin. Pour a maximized copper area to the GND pin and the VIN pin to help thermal dissipation. 2. Input capacitor should be connected to the VIN pin and the GND pin as close as possible. 3. Make the current trace from VOUT pins to L to the GND as short as possible. 4. Pour copper plane on all unused board area and connect it to stable DC nodes, like VIN, GND, or VOUT. 5. Keep sensitive signal traces such as trace connecting FB pin away from the VOUT pins. |
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