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LTC3831 Datasheet(PDF) 13 Page - Linear Technology

Part # LTC3831
Description  High Power Synchronous Switching Regulator Controller for DDR Memory Termination
PDF  20 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTC3831 Datasheet(HTML) 13 Page - Linear Technology

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LTC3831
3831f
APPLICATIO S I FOR ATIO
Power MOSFETs
Two N-channel power MOSFETs are required for most
LTC3831 circuits. These should be selected based prima-
rily on threshold voltage and on-resistance considerations.
Thermal dissipation is often a secondary concern in high
efficiency designs. The required MOSFET threshold should
be determined based on the available power supply volt-
ages and/or the complexity of the gate drive charge pump
scheme. In 3.3V input designs where an auxiliary 12V
supply is available to power PVCC1 and PVCC2, standard
MOSFETs with RDS(ON) specified at VGS = 5V or 6V can be
used with good results. The current drawn from this sup-
ply varies with the MOSFETs used and the LTC3831’s
operating frequency, but is generally less than 50mA.
LTC3831 applications that use 5V or lower VIN voltage and
doubling/tripling charge pumps to generate PVCC1 and
PVCC2, do not provide enough gate drive voltage to fully
enhance standard power MOSFETs. Under this condition,
the effective MOSFET RDS(ON) may be quite high, raising
the dissipation in the FETs and reducing efficiency. Logic-
level FETs are the recommended choice for 5V or lower
voltage systems. Logic-level FETs can be fully enhanced
with a doubler/tripling charge pump and will operate at
maximum efficiency.
After the MOSFET threshold voltage is selected, choose
the RDS(ON) based on the input voltage, the output voltage,
allowable power dissipation and maximum output cur-
rent. In a typical LTC3831 circuit operating in continuous
mode, the average inductor current is equal to the output
load current. This current flows through either Q1 or Q2
with the power dissipation split up according to the duty
cycle:
DC Q
V
V
DC Q
V
V
VV
V
OUT
IN
OUT
IN
IN
OUT
IN
()
()
–
–
1
21
=
==
The RDS(ON) required for a given conduction loss can now
be calculated by rearranging the relation P = I2R.
R
P
DC Q
I
VP
VI
R
P
DC Q
I
VP
VV
I
DS ON Q
MAX Q
LOAD
IN
MAX Q
OUT
LOAD
DS ON Q
MAX Q
LOAD
IN
MAX Q
IN
OUT
LOAD
()
()
()
()
()
()
() • (
)
•
•(
)
() • (
)
•
(–
) • (
)
1
1
2
1
2
2
2
2
2
2
1
2
==
==
PMAX should be calculated based primarily on required
efficiency or allowable thermal dissipation. A typical high
Figure 8. Typical Application with VTT = 0.6 • VDDQ
TG
IMAX
IFB
BG
PGND
GND
R+
FB
VCC
SS
FREQSET
SHDN
COMP
PVCC2
MBR0530T1
5V
10k
1k
0.1
µF
0.1
µF
LO
1.2
µH
Q2
CIN: SANYO POSCAP 6TPB330M
COUT: SANYO POSCAP 4TPB470M
Q1, Q2: SILICONIX Si4410DY
COUT
470
µF
×3
VTT
1.5V
±6A
2k
1%
10k
1%
3831 F08
Q1
MBRS340T3
MBRS340T3
VDDQ
2.5V
LTC3831
1
µF
SHDN
+
4.7
µF
PVCC1
R–
+
CIN
330
µF
×2
+
0.1
µF
C1
33pF
0.01
µF
130k
CC
1500pF
RC
15k



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