ADG901 datasheet(3/12 Pages) AD

3 / 12 page

REV. A

ADG901/ADG902

–3–

ABSOLUTE MAXIMUM RATINGS

(TA = 25

°C, unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4 V

Inputs to GND . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.3 V

Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA

Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dBm

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

MSOP Package

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . . 206

°C/W

LFCSP Package

JA Thermal Impedance (2-layer board) . . . . . . . . . . 84

°C/W

JA Thermal Impedance (4-layer board) . . . . . . . . . . 48

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300

°C

IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235

°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV

NOTES

1 Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only and functional operation of

the device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

2 RF1/2 Off Port Inputs to Ground ................................... –0.5 V to V

DD – 0.5 V

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

ADG901/ADG902 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

ADG901BRM

–40

°C to +85°CMini Small Outline Package (MSOP)

RM-8

W6B

ADG901BRM-500RL7

–40

°C to +85°CMini Small Outline Package (MSOP)

RM-8

W6B

ADG901BRM-REEL7

–40

°C to +85°CMini Small Outline Package (MSOP)

RM-8

W6B

ADG901BCP-500RL7

–40

°C to +85°CLead Frame Chip Scale Package (LFCSP)

CP-8

W6B

ADG901BCP-REEL7

–40

°C to +85°CLead Frame Chip Scale Package (LFCSP)

CP-8

W6B

ADG902BRM

–40

°C to +85°CMini Small Outline Package (MSOP)

RM-8

W7B

ADG902BRM-500RL7

–40

°C to +85°CMini Small Outline Package (MSOP)

RM-8

W7B

ADG902BRM-REEL7

–40

°C to +85°CLead Frame Chip Scale Package (LFCSP)

RM-8

W7B

ADG902BCP-500RL7

–40

°C to +85°CLead Frame Chip Scale Package (LFCSP)

CP-8

W7B

ADG902BCP-REEL7

–40

°C to +85°CLead Frame Chip Scale Package (LFCSP)

CP-8

W7B

EVAL-ADG901EB

Evaluation Board

EVAL-ADG902EB

Evaluation Board

Table I. Truth Table

CTRL

Signal Path

RF1 isolated from RF2

RF1 to RF2

PIN CONFIGURATION

8-Lead MSOP (RM-8)

8-Lead 3 mm

3 mm LFCSP (CP-8)

TOP VIEW

(Not to Scale)

VDD

CTRL

GND

RF1

ADG901/

ADG902

GND

RF2

GND

PIN FUNCTION DESCRIPTIONS

Pin No.

Mnemonic

Function

1VDD

Power Supply Input. These parts can

be operated from 1.65 V to 2.75 V;

VDD should be decoupled to GND.

CTRL

CMOS or TTL Logic Level.

➞ RF1 Isolated from RF2

➞ RF1 to RF2

3, 5, 6, 7

GND

Ground Reference Point for All

Circuitry on the Part.

RF1

RF1 Port.

RF2

RF2 Port.

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