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BLF1049 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BLF1049 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 2003 May 14 3 Philips Semiconductors Product specification Base station LDMOS transistor BLF1049 THERMAL CHARACTERISTICS Notes 1. Thermal resistance is determined under RF operating conditions. 2. Depending on mounting condition in application. CHARACTERISTICS Tj =25 °C unless otherwise specified. APPLICATION INFORMATION RF performance in a common source class-AB circuit; VDS =27V; Th =25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-c thermal resistance from junction to case Th =25 °C, PL = 35 W (AV), note 1 0.42 K/W Rth j-h thermal resistance from junction to heatsink Th =25 °C, PL = 35 W (AV), note 2 0.62 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)DSS drain-source breakdown voltage VGS = 0; ID = 3 mA 75 −− V VGSth gate-source threshold voltage VDS = 10 V; ID = 300 mA 4 − 5V IDSS drain-source leakage current VGS = 0; VDS =36V −− 3 µA IDSX on-state drain current VGS =VGSth +9V; VDS =10V 45 −− A IGSS gate leakage current VGS = ±20 V; VDS =0 −− 1 µA gfs forward transconductance VDS = 10 V; ID =10A − 9 − S RDSon drain-source on-state resistance VGS =9V; ID =10A − 60 − m Ω Mode of operation: 2-tone CW, 100 kHz spacing; IDQ = 1130 mA; f = 890 MHz SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Gp gain power PL = 125 W (PEP) 14.6 15.5 − dB η D drain efficiency 33 37 − % IRL input return loss −−12 −6dB d3 third order inter modulation distortion −−32 −25 dBc Mode of operation: GSM EDGE; IDQ = 750 mA; f = 920 MHz SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Gp gain power PL =45W(AV) − 15 − dB η D drain efficiency − 32 − % ACPR 400 adjacent channel power ratio −−64 − dBc EVM (AV) EVM rms average signal distortion − 2 − % EVM peak EVM rms peak signal distortion − 2.2 − % Mode of operation: 1-tone CW; IDQ = 1000 mA; f = 920 MHz SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Gp gain power PL =PL 1 dB = 125 W − 16.5 − dB ηD drain efficiency − 54 − % |
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