TS19830CS datasheet(2/8 Pages) TSC

2 / 8 page

TS19830CS

Taiwan Semiconductor

Version: A1704

ABSOLUTE MAXIMUM RATINGS (Note 1)

PARAMETER

SYMBOL

LIMIT

UNIT

Power Supply Pin

VCC

CS Voltage to GND

VCS

-0.3 to 5.5

DRAIN Voltage to GND

VDRAIN

-0.3 to 500

CS Voltage to GND

VCS

-0.3 to 5.5

CL Voltage to GND

VCL

-0.3 to 5.5

COM Voltage to GND

VCOM

-0.3 to 5.5

Junction Temperature Range

-40 to +150

°C

Storage Temperature Range

TSTG

-65 to +150

°C

Lead Temperature (Soldering 10s)

TLEAD

260

°C

Power Dissipation @ TA=25 °C

0.6

ESD Rating (Human Body Mode)

(Note2)

HBM

ESD Rating (Machine Mode)

(Note 2)

200

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Thermal Resistance - Junction to Case

RӨJC

°C/W

Thermal Resistance - Junction to Ambient

RӨJA

208

°C/W

Note: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined at

the solder mounting surface of the drain pins. RӨJA is guaranteed by design while RӨCA is determined by the user’s board

design. RӨJA shown below for single device operation on FR-4 PCB in still air. Thermal Resistance is specified with the

component mounted on a low effective thermal conductivity test board in free air at TA=25°C.

RECOMMENDED OPERATING CONDITIONS (Note 3)

PARAMETER

SYMBOL

CONDITIONS

UNIT

Power Supply Pin

VCC

CL Voltage to GND

VCL

-0.3 to 0.3

DRAIN Voltage to GND

VDRAIN

-0.3 to 500

CS Voltage to GND

VCS

-0.3 to 5

COM Voltage to GND

VCOM

-0.3 to 5

Operating Junction Temperature Range

-40 to +125

°C

Operating Ambient Temperature Range

TOPA

-40 to +85

°C

TS19830CS Datasheet(PDF) 2 Page - Taiwan Semiconductor Company, Ltd

TS19830CS Datasheet(HTML) 2 Page - Taiwan Semiconductor Company, Ltd

Html Pages

1 2 3 4 5 6 7 8

Datasheet Download

Link URL