ATPL230A datasheet(116/122 Pages) ATMEL

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ATPL230A [DATASHEET]

Atmel-43053J-ATPL230A-Datasheet_22-Sep-16

116

12.

Recommended mounting conditions

12.1

Conditions of Standard Reflow

Figure 12-1. LQFP80 package soldering profile

Note:

H rank: 260ºC Max

Average ramp-up rate:

1ºC/s to 4ºC/s

Preheat & Soak:

170ºC to 190ºC, 60s to 180s

Average ramp-up rate:

1ºC/s to 4ºC/s

Peak temperature:

260ºC Max, up to 255ºC within 10s

d’:

Liquidous temperature:

Up to 230ºC within 40s or

Up to 225ºC within 60s or

Up to 220ºC within 80s

Cooling:

Natural cooling or forced cooling

Table 12-1.

Conditions of Standard Reflow

Items

Contents

Method

IR (Infrared Reflow) / Convection

Times

Floor Life

Before unpacking

Please use within 2 years after

production

From unpacking to second reflow

Within 8 days

In case over period of floor life

Baking with 125ºC +/- 3ºC for 24hrs

+2hrs/-0hrs is required. Then please

use within 8 days (please remember

baking is up to 2 times).

Floor Life Condition

Between 5ºC and 30ºC and also below 70% RH required. (It is preferred lower

humidity in the required temp. range).

ATPL230A Datasheet(PDF) 116 Page - ATMEL Corporation

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