OP270GSZ datasheet(21/21 Pages) AD

21 / 21 page

OP270

Data Sheet

Rev. F | Page 20 of 20

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013-AA

10.50 (0.4134)

10.10 (0.3976)

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75 (0.0295)

0.25 (0.0098)

45°

1.27 (0.0500)

0.40 (0.0157)

COPLANARITY

0.10

0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

SEATING

PLANE

8°

0°

1.27 (0.0500)

BSC

Figure 50. 16-Lead Standard Small Outline Package [SOIC_W]

Wide Body

S-Suffix

(RW-16)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model1

TA = +25°C

VOS Max (μV)

θJC

(°C/W)

θJA2

(°C/W)

Temperature Range

Package Description

Package

Option

OP270EZ

134

−40°C to +85°C

8-Lead CERDIP

Q-8 (Z-Suffix)

OP270FZ

150

134

−40°C to +85°C

8-Lead CERDIP

Q-8 (Z-Suffix)

OP270GP

250

−40°C to +85°C

8-Lead PDIP

N-8 (P-Suffix)

OP270GPZ

−40°C to +85°C

8-Lead PDIP

N-8 (P-Suffix)

OP270GS

250

−40°C to +85°C

16-Lead SOIC_W

RW-16 (S-Suffix)

OP270GS-REEL

−40°C to +85°C

16-Lead SOIC_W

RW-16 (S-Suffix)

OP270GSZ

−40°C to +85°C

16-Lead SOIC_W

RW-16 (S-Suffix)

OP270GSZ-REEL

−40°C to +85°C

16-Lead SOIC_W

RW-16 (S-Suffix)

1 The OP270GPZ, OP270GSZ, and OP270GSZ-REEL are RoHS compliant parts.

2 θJA is specified for worst-case mounting conditions, that is, θJA is specified for device in socket for CERDIP and PDIP packages; θJA is specified for device soldered to

printed circuit board for SOIC package.

registered trademarks are the property of their respective owners.

D00325-0-10/15(F)

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