PC755 datasheet(37/50 Pages) ATMEL

37 / 50 page

PC755/745

2138D–HIREL–06/03

Preparation for Delivery

Packaging

Microcircuits are prepared for delivery in accordance with MIL-PRF-38535.

Certificate of Compliance

Atmel offers a certificate of compliances with each shipment of parts, affirming the prod-

ucts are in compliance either with MIL-PRF-883 and guarantying the parameters not

tested at temperature extremes for the entire temperature range.

Handling

MOS devices must be handled with certain precautions to avoid damage due to accu-

mulation of static charge. Input protection devices have been designed in the chip to

minimize the effect of static buildup. However, the following handling practices are

recommended:

Devices should be handled on benches with conductive and grounded surfaces.

Ground test equipment, tools and operator.

Do not handle devices by the leads.

Store devices in conductive foam or carriers.

Avoid use of plastic, rubber, or silk in MOS areas.

Maintain relative humidity above 50 percent if practical.

For CI-CGA packages, use specific tray to take care of the highest height of the

package compared with the normal CBGA.

Package Mechanical

Data

The following sections provide the package parameters and mechanical dimensions for

the PC745, 255 PBGA package as well as the PC755, 360 CBGA and PBGA packages.

While both the PC755 plastic and the ceramic packages are described here, both pack-

ages are not guaranteed to be available at the same time. All new designs should allow

for either ceramic or plastic BGA packages for this device. For more information on

designing a common footprint for both plastic and ceramic package types, please con-

tact your local Motorola sales office.

Parameters for the

PC745

Package Parameters for the

PC745 PBGA

The package parameters are as provided in the following list. The package type is

21 x 21 mm, 255-lead plastic ball grid array (PBGA).

Mechanical Dimensions of the

PC745 PBGA Package

Figure 25 provides the mechanical dimensions and bottom surface nomenclature of the

PC745, 255 PBGA package.

Package outline

21 x 21 mm

Interconnects

255 (16 x 16 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.25 mm

Maximum module height

2.80 mm

Ball diameter (typical)

0.75 mm (29.5 mil)

PC755 Datasheet(PDF) 37 Page - ATMEL Corporation

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