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Page 24 of 24

Issue 0

OUTLINE DIMENSIONS

P DIP 16 = EP

(ML145162EP)

PLASTIC DIP

CASE 648–08

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

–A–

B

F

C

S

H

G

D

J

L

M

16 PL

SEATING

18

9

16

K

PLANE

–T–

M

A

M

0.25 (0.010)

T

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.740

0.770

18.80

19.55

B

0.250

0.270

6.35

6.85

C

0.145

0.175

3.69

4.44

D

0.015

0.021

0.39

0.53

F

0.040

0.70

1.02

1.77

G

0.100 BSC

2.54 BSC

H

0.050 BSC

1.27 BSC

J

0.008

0.015

0.21

0.38

K

0.110

0.130

2.80

3.30

L

0.295

0.305

7.50

7.74

M

0

10

0

10

S

0.020

0.040

0.51

1.01

SOG 16 = -5P

(ML145162-5P)

SOG PACKAGE

CASE 751B–05

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

18

16

9

SEATING

PLANE

F

J

M

G

8 PL

P

–B–

–A–

M

0.25 (0.010)

–T–

D

K

C

16 PL

S

B

M

0.25 (0.010)

T

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

9.80

10.00

0.386

0.393

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.054

0.068

D

0.35

0.49

0.014

0.019

F

0.40

1.25

0.016

0.049

G

1.27 BSC

0.050 BSC

J

0.19

0.25

0.008

0.009

K

0.10

0.25

0.004

0.009

M

0

7

0

7

P

5.80

6.20

0.229

0.244

R

0.25

0.50

0.010

0.019

LANSDALE Semiconductor, Inc.

ML145162

Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-

ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which

may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s

technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.