AB136 LUXEON MZ Application Brief 20150528 ©2015 Lumileds Holding B.V. All rights reserved.

3

1. Component

1.1 Description

The LUXEON MZ emitter (see Figure 1) consists of four InGaN LED die packed in 2x2 array mounted onto a ceramic

substrate. This substrate provides mechanical support and thermally connects the LED die to a thermal pad on the bottom

of the substrate. An electrical interconnect via connects the LED die to a cathode and anode on the bottom of the ceramic

substrate.

Each LUXEON MZ emitter includes a transient voltage suppressor (TVS) chip to protect the emitter against electrostatic

discharges (ESD). The TVS chip creates some minor topographical variations across the top surface of the LUXEON MZ

emitters.

The entire top surface of the LUXEON MZ is covered with a thin layer of silicone, with phosphor embedded, to shield the

chip from the environment and to convert the blue light from the die into white light.

The bottom of the LUXEON MZ emitter contains four metallization pads, a large electrically isolated thermal pad in the

center, an anode, a cathode, and a small pad with a laser engraved LED serial number in standard 2D data matrix code

(electrically isolated). The pad with the serial number is not designed to be soldered onto a PCB.

1.2 Optical Center

The LUXEON MZ theoretical optical center is located 1.88mm away from the short edge of LUXEON MZ, opposite to the

TVS and 2.00mm from the long edge of LUXEON MZ (see Figure 2). Note that this optical center is not the same position as

the mechanical package center.

Figure 1. Top view (left) and bottom view (right) of LUXEON MZ emitter.

The pad with laser marking should not be soldered onto a PCB.

Optical rayset files for LUXEON MZ are available from our website: www .lumileds .com.