ADF4154BCP datasheet(20/20 Pages) AD

20 / 20 page

ADF4154

Rev. 0 | Page 20 of 20

OUTLINE DIMENSIONS

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153AB

Figure 26. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

BOTTOM

VIEW

2.25

2.10 SQ

1.95

0.75

0.55

0.35

0.30

0.23

0.18

0.50

BSC

12° MAX

0.20

REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

1.00

0.85

0.80

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

3.75

BSC SQ

4.0

BSC SQ

COPLANARITY

0.08

0.60

MAX

0.60

MAX

0.25 MIN

COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1

Figure 27. 20-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body, (CP-20)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Description

Temperature Range

Package Option

ADF4154BRU

Thin Shrink Small Outline Package (TSSOP)

−40°C to +85°C

RU-16

ADF4154BRU-REEL

Thin Shrink Small Outline Package (TSSOP)

−40°C to +85°C

RU-16

ADF4154BRU-REEL7

Thin Shrink Small Outline Package (TSSOP)

−40°C to +85°C

RU-16

ADF4154BCP

Lead Frame Chip Scale Package (LFCSP)

−40°C to +85°C

CP-20

ADF4154BCP-REEL

Lead Frame Chip Scale Package (LFCSP)

−40°C to +85°C

CP-20

ADF4154BCP-REEL7

Lead Frame Chip Scale Package (LFCSP)

−40°C to +85°C

CP-20

EVAL-ADF4154EB1

Purchase of licensed I2C components of Analog Devices, Inc. or one of its sublicensed Associated Companies conveys a license for the purchaser under the

Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips.

registered trademarks are the property of their respective owners.

D04833–0–4/04(0)

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