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LTM4662 Datasheet(PDF) 21 Page - Linear Technology

Part # LTM4662
Description  Dual 15A or Single 30A DC/DC 關Module Regulator
PDF  34 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTM4662 Datasheet(HTML) 21 Page - Linear Technology

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LTM4662
21
4662f
For more information www.linear.com/LTM4662
Figure 7. Diode Voltage VD vs Temperature T(°C)
for Different Bias Currents
where VD appears to increase with temperature. It is com-
mon knowledge that a silicon diode biased with a current
source has an approximate –2mV/°C temperature rela-
tionship (Figure 7), which is at odds with the equation
term, increases with temperature, reducing the ln(ID/IS)
absolute value yielding an approximate –2mV/°C com-
posite diode voltage slope.
APPLICATIONS INFORMATION
Solving for temperature:
T(KELVIN) =
∆VD
K'D
,
T(KELVIN) = [°C]+ 273.15,
[°C] = T(KELVIN) − 273.15
means that if we take the difference in voltage across the
diode measured at two currents with a ratio of 10, the
resulting voltage is 198V per Kelvin of the junction with
a zero intercept at 0 Kelvin. The diode connected NPN
transistor at the TEMP+, TEMP–pins can be used to moni-
tor the internal temperature of the LTM4662. A general
temperature monitor can be implemented by connecting
a resistor between TEMP+ and VIN to set the current to
100 A, grounding the TEMP– pin and then monitoring
the diode voltage drop with temperature. A more accurate
temperature monitor can be achieved with a circuit inject-
ing two currents that are at a 10:1 ratio. See LTC2997
data sheet.
Thermal Considerations and Output Current Derating
The thermal resistances reported in the Pin Configuration
section of the data sheet are consistent with those param-
eters defined by JESD51-12 and are intended for use with
finite element analysis (FEA) software modeling tools that
leverage the outcome of thermal modeling, simulation,
and correlation to hardware evaluation performed on a
Module® package mounted to a hardware test board.
The motivation for providing these thermal coefficients
is found in JESD51-12 (“Guidelines for Reporting and
Using Electronic Package Thermal Information”). Many
designers may opt to use laboratory equipment and a test
vehicle such as the demo board to anticipate the Module
regulator’s thermal performance in their application at
various electrical and environmental operating conditions
to compliment any FEA activities. Without FEA software,
the thermal resistances reported in the Pin Configuration
section are in-and-of themselves not relevant to provid-
ing guidance of thermal performance; instead, the derat-
ing curves provided in the data sheet can be used in a
manner that yields insight and guidance pertaining to
one’s application-usage, and can be adapted to corre-
late thermal performance to one’s own application. The
4662 F07
TEMPERATURE (°C)
–173
–73
27
127
0.4
0.6
0.8
1.0
∆VD
ID = 100µA
ID = 10µA
To obtain a linear voltage proportional to temperature,
we cancel the IS variable in the natural logarithm term to
remove the IS dependency from the following equation.
This is accomplished by measuring the diode voltage at
two currents I1, and I2, where I1 = 10 • I2.
Subtracting we get:
∆VD = T(KELVIN) • KD •In
I1
IS
− T(KELVIN) • KD •In
I2
IS
Combining like terms, then simplifying the natural log
terms yields:
∆VD = T(KELVIN) • KD • In(10)
and redefining constant
K’D = KD • In(10) = 198µV/k
yields
∆VD = K’D • T(KELVIN)



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