LTM4625 datasheet(20/26 Pages) LINER

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LTM4625

Rev C

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APPLICATIONS INFORMATION

Figure 19. Recommended PCB Layout

Safety Considerations

The LTM4625 modules do not provide galvanic isolation

from VIN to VOUT. There is no internal fuse. If required,

a slow blow fuse with a rating twice the maximum input

current needs to be provided to protect each unit from

catastrophic failure. The device does support thermal

shutdown and over current protection.

Layout Checklist/Example

The high integration of LTM4625 makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout consid-

erations are still necessary.

• Use large PCB copper areas for high current paths,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VIN, PGND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put via directly on the pad, unless they are

capped or plated over.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to GND underneath the unit.

• Bring out test points on the signal pins for monitoring.

• KeepseparationbetweenCLKIN,CLKOUTandFREQpin

traces to minimize possibility of noise due to crosstalk

between these signals.

Figure19givesagoodexampleoftherecommendedlayout.

VIN

COUT

GND

VOUT

RFB

4625 F19

GND

CIN

LTM4625 Datasheet(PDF) 20 Page - Linear Technology

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