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LTM4677 Datasheet(PDF) 6 Page - Linear Technology

Part # LTM4677
Description  PolyPhase Step-Down Synchronous Slave Controller with Sub-Milliohm DCR Sensing
PDF  22 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTM4677 Datasheet(HTML) 6 Page - Linear Technology

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LTC3874-1
6
38741f
For more information www.linear.com/LTC3874-1
pin FuncTions
ISENSE0
+/ISENSE1+(Pin 1/Pin 6): Current Sense Compara-
tor Inputs. The (+) inputs to the current comparators are
normally connected to DCR sensing networks.
ISENSE0
−/ISENSE1−(Pin 2/Pin 5): Current Sense Compara-
tor Inputs. The (−) inputs to the current comparators are
connected to the outputs.
RUN0/RUN1 (Pin 3/Pin 4): Enable Run Inputs. Logic high
on the RUN pin enables the corresponding channel.
MODE0/MODE1(Pin 24/Pin 7): DCM/CCM Mode Control
Pins. Each channel runs in forced continuous mode if the
mode pin is logic high. There is an internal 500k pull-down
resistor on the mode pin. To select discontinuous conduc-
tion mode, float or pull down the mode pin.
ITH0/ITH1(Pin 23/Pin 8): Current Control Threshold. Each
associatedchannel’scurrentcomparatortrippingthreshold
increases with its ITH voltage. These pins must be con-
nected to the master controller’s ITH pins.
FREQ(Pin 9): Frequency Set Pin. There is a precision
10µA current flowing out of this pin. A resistor to ground
sets a voltage which in turn programs the frequency. This
pin sets the default switching frequency when there is no
external clock on the SYNC pin. See the application section
for detailed information.
ILIM(Pin 10): Current Comparators Sense Voltage Limit.
Program a DC voltage at this pin to set the maximum cur-
rent sense threshold for the current comparators.
SYNC (Pin 11): External Clock Synchronization Input. If an
externalclockispresentatthispin,theswitchingfrequency
will be synchronized to the falling edge of external clock.
Tie this pin to GND if not used.
PHASMD (Pin 12): Phase Set Pin. This pin determines the
relative phases between the external clock on pin SYNC
and the internal controllers. See Table 1 in the Operation
section for details.
PWM0/PWM1(Pin 19/Pin 13): (Top) Gate Signal Outputs.
This signal goes to the PWM or top gate input of the exter-
nal driver, integrated driver MOSFET or power block. This
is a three-state compatible output. To support three-state
mode, an external resistor divider is typically used from
VCC0/VCC1 to ground.
VCC0/VCC1(Pin 18/Pin 14): PWM Pin Driver Supplies.
Decouple this pin to GND with a capacitor (0.1μF) to an
external supply or tie this pin to the INTVCC pin. PWM0/
PWM1 signal swing is from ground to VCC0/VCC1.
EXTVCC(Pin15):ExternalPowerInputtoanInternalSwitch
Connected to INTVCC. The switch closes and supplies the
IC power, bypassing the internal low dropout regulator,
whenever EXTVCC is higher than 4.7V and VIN is greater
than 7V. Do not exceed 6V on this pin.
INTVCC(Pin16):Internal5.5VRegulatorOutput.Thecontrol
circuits are powered from this voltage. Decouple this pin
to GND with a minimum of 4.7μF low ESR tantalum or
ceramic capacitor.
VIN (Pin 17): Main Input Supply. Decouple this pin to GND
with a capacitor (0.1μF to 1μF).
FAULT0/FAULT1 (Pin 21/Pin 20): Master Controller Fault
Inputs. Connect these pins to the master chip fault indica-
tor pins to respond to the fault signals from the master
controller. When a FAULT pin is floating or low, the PWM
pin of the corresponding channel is in three-state. There
is an internal 500k pull-down resistor on each FAULT pin.
LOWDCR(Pin 22): Sub-milliohm DCR Current Sensing
Enable Pin. There is an internal 500k pull-up resistor
between the LOWDCR pin and INTVCC. Floating or pull-
ing this pin logic high will enable the sub-milliohm DCR
current sensing. Pulling this pin logic low will disable the
sub-milliohm DCR current sensing.
GND(Exposed Pad Pin 25): Ground. Connect this pad,
through vias, to a solid ground plane under the circuit.
The sources of the bottom N-channel MOSFETs, the (–)
terminal of CINTVCC, and the (–) terminal of CIN should
connect to this ground plane as closely as possible to
the IC. All small-signal components and compensation
components should also connect to this ground plane.



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