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LTC2602 Datasheet(PDF) 10 Page - Linear Technology

Part # LTC2602
Description  16-Bit, 5Msps Differential Input ADC with Wide Input Common Mode Range
PDF  26 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

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LTC2311-16
10
231116fa
For more information www.linear.com/LTC2311-16
PIN FUNCTIONS
GND(Pins1,5,8,11):Ground.Thesepinsandtheexposed
pad (Pin 17) must be tied directly to a solid ground plane.
REFIN (Pin 2): Reference Buffer 1.25V Input/Output. An
onboard buffer nominally outputs 1.25V to this pin. This
pin should be decoupled closely to the pin (no vias) with
a 10μF (X5R, 0805 size) ceramic capacitor. The internal
buffer driving this pin may be overdriven with an external
reference. The REFIN pin, when pulled to GND disables
the REFOUT pin buffer allowing an external reference to
drive REFOUT directly.
REFOUT (Pin 3): Reference Buffer Output. An onboard
buffernominallyoutputs4.096Vtothispin.Thispinshould
be decoupled closely to the pin (no vias) with a 10μF (X5R,
0805 size) ceramic capacitor. The internal buffer driving
this pin may be disabled by grounding the REFIN pin. If
the buffer is disabled, an external reference may drive this
pin in the range of 1.25V to VDD.
VDD (Pin 4): Power Supply. Bypass VDD to GND with a
1µF ceramic capacitor close to the VDD pin.
AIN+, AIN– (Pins 6, 7): Analog Differential Input Pins. Full-
scale range (AIN+ to AIN–) is ±REFOUT voltage. These pins
can be driven from VDD to GND.
CNV (Pin 9): Convert Input. This pin, when high, defines
the sampling phase. When this pin is driven low, the con-
version phase is initiated and output data is clocked out.
This input pin is a TTL style input typically driven at OVDD
levels with a low jitter pulse, but it is bound to VDD levels.
This pin is unaffected by the CMOS/LVDS pin.
CMOS/LVDS (Pin 10): I/O mode select. Ground this pin
to enable CMOS mode, tie to OVDD to enable LVDS mode.
Float this pin to enable low power LVDS mode.
OVDD (Pin 12): I/O Interface Digital Power. The range of
OVDD is 1.71V to 2.5V. This supply is nominally set to the
same supply as the host interface (CMOS: 1.8V or 2.5V,
LVDS: 2.5V). Bypass OVDD to GND with a 1μF ceramic
capacitor close to the OVDD pin.
Exposed Pad (Pin 17): Ground. Solder this pad to ground.
CMOS I/O Mode
SDO+ (Pin 14): Serial Data Output. The conversion result
is shifted MSB first on each falling edge of SCK. The result
is output on SDO+. The logic level is determined by OVDD.
Do not connect SDO–.
SCK+ (Pin 16): Serial Data Clock Input. The falling edge
of this clock shifts the conversion result MSB first onto
the SDO pins. Drive SCK+ with a single-ended clock. The
logic level is determined by OVDD. Do not connect SCK–.
LVDS I/O Mode
SDO+, SDO– (Pins 14, 13): Serial Data Output. The con-
version result is shifted MSB first on each falling edge of
SCK. The result is output differentially on SDO+ and SDO–.
These pins must be differentially terminated by an external
100Ω resistor at the receiver (FPGA).
SCK+, SCK– (Pins 16, 15): Serial Data Clock Input. The
falling edge of this clock shifts the conversion result MSB
first onto the SDO pins. Drive SCK+ and SCK– with a dif-
ferentialclock.Thesepinsmustbedifferentiallyterminated
by an external 100Ω resistor at the receiver (ADC).



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