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LTC4211 Datasheet(PDF) 12 Page - Linear Technology |
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LTC4211 Datasheet(HTML) 12 Page - Linear Technology |
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12 / 22 page ![]() LTC4235 12 4235f For more information www.linear.com/LTC4235 applicaTions inForMaTion During a normal power-up, the ideal diode MOSFETs turn onfirst.Assoonastheinternallygeneratedsupply,INTVCC, rises above its 2.2V undervoltage lockout threshold, the internal charge pump is allowed to charge up the CPO pins. Because the ideal diode MOSFETs are connected in parallelasadiode-OR,theSENSE+pinvoltageapproaches the highest of the supplies at the IN1 and IN2 pins. The MOSFET associated with the lower input supply voltage willbeturnedoffbythecorrespondinggatedriveamplifier. Before the Hot Swap MOSFET can be turned on, EN must remainlowandONmustremainhighfora100msdebounce timing cycle to ensure that any contact bounces during the insertion have ceased. At the end of the debounce cycle, the internal fault latch is cleared. The Hot Swap MOSFET is then allowed to turn on by charging up HGATE with a 10µA current source from the charge pump. The voltage at the HGATE pin rises with a slope equal to 10µA/CHG and the supply inrush current flowing into the load capacitor CL is limited to: IINRUSH = CL CHG •10µA The OUT voltage follows the HGATE voltage when the Hot Swap MOSFET turns on. If the voltage across the current sense resistor RS becomes too high based on the OUT pin voltage, the inrush current will be limited by the internal current limiting circuitry. Once the MOSFET gate overdrive exceeds 4.2V and the OUT pin voltage is above 10.5V, the PWRGD pin pulls low to indicate that the power is good. Once OUT reaches the input supply voltage, HGATE continues to ramp up. An internal 12V clamp limits the HGATE voltage above OUT. When the ideal diode MOSFET is turned on, the gate drive amplifier controls the gate of the MOSFET to servo the forward voltage drop across the MOSFET to 15mV. If the load current causes more than 15mV of drop, the MOSFET gate is driven fully on and the voltage drop is equal to ILOAD•RDS(ON). Turn-Off Sequence The external MOSFETs can be turned off by a variety of conditions. A normal turn-off for the Hot Swap MOSFET is initiated by pulling the ON pin below its 1.155V threshold (80mV ON pin hysteresis), or pulling the EN pin above its 1.235V threshold. Additionally, an overcurrent fault that exceeds the fault timer period also turns off the Hot Swap MOSFET. Normally, the LTC4235 turns off the MOSFET by pulling the HGATE pin to ground with a 2mA current sink. All of the MOSFETs turn off when INTVCC falls below its undervoltage lockout threshold (2.2V). The DGATE pin is pulled down with a 100µA current to one diode voltage below the IN pin, while the HGATE pin is pulled down to the OUT pin by a 200mA current. When D2OFF is pulled high above 1.235V, the ideal diode MOSFET in the IN2 power path is turned off with DGATE2 pulled low by a 100µA current. The gate drive amplifier controls the ideal diode MOSFET to prevent reverse current when the input supply falls below SENSE+. If the input supply collapses quickly, the gate drive amplifier turns off the ideal diode MOSFET with a fast pull-down circuit. If the input supply falls at a more modest rate, the gate drive amplifier controls the MOSFET to maintain SENSE+ at 15mV below IN. Board Presence Detect with EN If ON is high when the EN pin goes low, indicating a board presence, the LTC4235 initiates a debounce timing cycle for contact debounce. Upon board insertion, any bounces on the EN pin restart the timing cycle. When the debounce timing cycle is done, the internal fault latch is cleared. If the EN pin remains low at the end of the timing cycle, HGATE is charged up with a 10µA current source to turn on the Hot Swap MOSFET. If the EN pin goes high, indicating a board removal, the HGATE pin is pulled low with a 2mA current sink after a 20µs delay, turning off the Hot Swap MOSFET without clearing any latched fault. |
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