SD57030

4/7

TEST CIRCUIT SCHEMATIC

TEST CIRCUIT COMPONENT PART LIST

COMPONENT

DESCRIPTION

C19

200

µF / 63V ALLUMINIUM ELECTROLYTIC RADIAL LEAD CAPACITOR

C18, C14

0.1

µF / 500V SURFACE MOUNT CERAMIC CHIP CAPACITOR

C17

100 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR

C16, C12, C11,C1

47 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR

C15

10

µF / 50V ALUMINIUM ELECTROLYTIC RADIAL LEAD CAPACITOR

C13

100 pF ATC 700B SURFACE MOUNT CERAMIC CHIP CAPACITOR

C9, C2

0.8-8.0 pF GIGA TRIM VARIABLE CAPACITOR

C8

6.2 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR

C7, C6, C5 ,C4

10 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR

C3

3 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR

R3

120 0-IM, 2W SURFACE MOUNT CERAMIC CHIP CAPACITOR

R2

4.7 M OHM 1W SURFACE MOUNT CERAMIC CHIP CAPACITOR

R1

18 K OHM, 1W SURFACE MOUNT CERAMIC CHIP CAPACITOR

FB2, FB1

SHIELD BEAD SURFACE MOUNT EMI

L2, L1

INDUCTOR, 5 TURNS AIR WOUND #22AWG, ID=0.059[1.49], NYLON COATED MAGNET

WIRE

PCB

WOVEN FIBERGLASS REINFORCED PTFE 0.080’’ THK,

V

IN

RF

G

+

OUT

RF

+

D

+

D

V

NOTES:

1. DIMENSIONS AT COMPONENT SYMBOLS ARE REFERENCE FOR COMPONENT PLACEMENT.

2. GAP BETWEEN GROUND & TRANSMISSION LINE = 0.056 [1.42] +0.002 [0.05] -0.000 [0.00] TYP.

3. DIMENSIONS OF INPUT AND OUTPUT COMPONENT FROM EDGE OF TRANSMISSION LINES.