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HA5023 Datasheet(PDF) 14 Page - Renesas Technology Corp |
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HA5023 Datasheet(HTML) 14 Page - Renesas Technology Corp |
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14 / 17 page  HA5023 FN3393 Rev 9.00 Page 14 of 17 September 30, 2015 Die Characteristics DIE DIMENSIONS: 1650 m x 2540m x 483m METALLIZATION: Type: Metal 1: AlCu (1%) Thickness: Metal 1: 8k Å 0.4kÅ Type: Metal 2: AlCu (1%) Thickness: Metal 2: 16k Å 0.8kÅ SUBSTRATE POTENTIAL (Powered Up): V- PASSIVATION: Type: Nitride Thickness: 4k Å 0.4kÅ TRANSISTOR COUNT: 124 PROCESS: High Frequency Bipolar Dielectric Isolation Metallization Mask Layout HA5023 V+ NC V- NC NC -IN +IN -IN1 OUT2 +IN1 OUT |
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