4 of 15

April 10, 2001

79RC5000

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The RC5000 contains the following computational units:

Integer ALU. The RC5000 implements a full, single-cycle 64-bit ALU

for all integer ALU functions other than multiply and divide. Bypassing is

used to support back-to-back ALU operations at the full pipeline rate,

without requiring stalls for data dependencies.

Integer Multiply/Divide Unit. This unit is separated from the primary

ALU, to allow these longer latency operations to run in parallel with other

operations. The pipeline stalls only if an attempt to access the HI or LO

registers is made before the operation completes.

Floating-point ALU. This unit is responsible for all CP1/CP1X ALU

operations other than DIV/SQRT. The unit is pipelined to allow a single-

cycle repeat rate for single-precision operations

Floating-point DIV/SQRT unit. This unit is separated from the other

floating-point ALU, so that these long latency operations do not prevent

the issue of other floating point operations.

In addition, the RC5000 implements separate logical units to imple-

ment loads, stores, and branches.

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The input clock operates in a frequency range of 33MHz to 100MHz.

The pipeline frequency for the RC5000 is 2 to 8 times the input clock (up

to the maximum for the speed grade of CPU).

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The RC5000 utilizes special packaging techniques, to improve the

thermal properties of high-speed processors. The RC5000 is packaged

using cavity down packaging in a 223-pin PGA package with integral

thermal slug, and a 272-pin BGA package. These packages effectively

dissipate the power of the CPU, increasing device reliability.

The RC5000 utilizes an all-aluminum package with the die attached

to a normal copper lead frame mounted to the aluminum casing. Due to

the heat-spreading effect of the aluminum, the package allows for an

efficient thermal transfer between the die and the case. The aluminum

offers less internal resistance from one end of the package to the other,

reducing the temperature gradient across the package and therefore

presenting a greater area for convection and conduction to the PCB for

a given temperature. Even nominal amounts of airflow will dramatically

reduce the junction temperature of the die, resulting in cooler operation.

The RC5000 is guaranteed in a case temperature range of 0

° to

+85

° C. The type of package, speed (power) of the device, and airflow

conditions affect the equivalent ambient temperature conditions that will

meet this specification.

using the thermal resistance from case to ambient (

package.

The following equation relates ambient and case temperatures:

where P is the maximum power consumption at hot temperature,

Typical values for

Note: The RC5000 implements advanced power manage-

ment to substantially reduce the average power dissipation of

the device. This operation is described in the IDT79RV5000

RISC Microprocessor Reference Manual.

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Per the RC5000 Documentation errata, Revision 1.0, dated February

1999 and per the RC5000 Device errata, dated February 1999, mode

bits 20, 33 and 37 must be set to 1.

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January 1996: Corrected pin list for Clock/Control, Initialization, and

Secondary Cache interfaces in Pin Description section. Changed pins

AA19 and AA21 from Vcc to Vss in Advance Pin-Out section.

March 1997: Upgraded data sheet status from “Preliminary” to Final.

Added section on thermal considerations. Added section on absolute

maximum ratings.

June 1997: Revised Power Consumption and System Interface

Parameters.

September 1997: Added user notation on Boot Mode Bits 20 and 33

for 200 MHz frequency.

June 1998: Added 250 MHz. Changed naming conventions.

June 1999: Added 267 MHz and 300 MHz.

October 28, 1999: Added industrial temperature data and revised

package designation code in the Ordering Information section.

March 23, 2000: Expanded the data presentation in the System

Interface Parameters table and revised the values in this table.

April 10, 2001: In the Data Output and Data Output Hold categories

of the System Interface Parameters table, changed values in the Min

column for all speeds from 1.5 and 1.0 to 0.

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Airflow (ft/min)

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800

1000

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Table 2 Thermal Resistance (ýCA) at Various Airflows