AD8324

Rev. 0 | Page 16 of 16

OUTLINE DIMENSIONS

1

20

5

6

11

16

15

BOTTOM

VIEW

10

2.25

2.10 SQ

1.95

0.75

0.55

0.35

0.30

0.23

0.18

0.50

BSC

12° MAX

0.20

REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

1.00

0.85

0.80

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

3.75

BSC SQ

4.0

BSC SQ

COPLANARITY

0.08

0.60

MAX

0.60

MAX

0.25 MIN

COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1

Figure 30. 20-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body (CP-20)

Dimensions shown in millimeters

20

11

10

1

PIN 1

8°

0°

0.236

BSC

0.154

BSC

0.010

0.004

0.012

0.008

0.025

BSC

COPLANARITY

0.004

0.065

0.049

0.069

0.053

SEATING

PLANE

0.010

0.006

0.050

0.016

0.341

BSC

COMPLIANT TO JEDEC STANDARDS MO-137AD

Figure 31. 20-Lead Shrink Small Outline Package [QSOP] (RQ-20)

Dimensions shown in inches

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD8324JRQ

–25°C to +70°C

20-Lead QSOP

83.21

RQ-20

AD8324JRQ-REEL

–25°C to +70°C

20-Lead QSOP

83.2

1

RQ-20

AD8324JRQ-REEL7

–25°C to +70°C

20-Lead QSOP

83.2

1

RQ-20

AD8324JRQ-EVAL

Evaluation Board

AD8324ACP

–40°C to +85°C

20-Lead LFCSP

30.42

CP-20

AD8324ACP-REEL7

–40°C to +85°C

20-Lead LFCSP

30.4

2

CP-20

AD8324ACP-EVAL

Evaluation Board

© 2003 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

C04339–0–10/03(0)