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CA3140AM Datasheet(PDF) 22 Page - Renesas Technology Corp |
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CA3140AM Datasheet(HTML) 22 Page - Renesas Technology Corp |
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22 / 24 page ![]() CA3140, CA3140A FN957 Rev.10.00 Page 22 of 24 Jul 11, 2005 Metallization Mask Layout Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). The photographs and dimensions represent a chip when it is part of the wafer. When the wafer is cut into chips, the cleavage angles are 57o instead of 90 with respect to the face of the chip. Therefore, the isolated chip is actually 7 mils (0.17mm) larger in both dimensions. 62-70 (1.575-1.778) 4-10 (0.102-0.254) 60 50 40 30 20 10 0 58-66 (1.473-1.676) 50 40 30 20 10 61 0 60 65 |
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