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MAX3521 Datasheet(PDF) 3 Page - Maxim Integrated Products

Part # MAX3521
Description  Easy Evaluation of the MAX3521
PDF  11 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX3521 Datasheet(HTML) 3 Page - Maxim Integrated Products

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Evaluates: MAX3521
MAX3521 Evaluation Kit
Detailed Description
Gain Calculations
The 1:4 impedance ratio transformer (T1) on the EV kit
converts the unbalanced 50Ω impedance of the signal
generator to a balanced 200Ω, matching the input of the
device. T1 is included to assist in evaluation of the device
using standard 50Ω lab equipment. It is not required for
most applications.
A 1:4 impedance ratio corresponds to a 1:2 voltage ratio,
or 6dB voltage gain. The power loss of T1, which must
be included, is approximately 0.3dB across the operating
frequency range of the device, giving a total voltage gain
due to T1 of 5.7dB.
A minimum loss pad (MLP) on the output of T2 trans-
forms the 75Ω output impedance of the device to 50Ω
test-equipment impedance, with a voltage loss of 7.4dB.
Because the 1:2 impedance ratio output transformer (T2)
is required in the application, we do not include the loss in
this transformer in the voltage-gain calculation.
To calculate the voltage gain of the device from 50Ω
power measurements at RFIN and RFOUT on the EV kit:
AV = POUT(dBm) + 7.4dB (MLP) - [PIN(dBm) + 5.7dB (T1)]
= POUT(dBm) - PIN(dBm) + 1.7dB
Layout Considerations
The EV kit can serve as a guide for PCB layout. Keep
RF signal lines as short as possible to minimize losses
and radiation. To minimize second-order distortion, traces
in the balanced input and output circuitry should be
as symmetric as possible. The exposed pad must be
soldered evenly to the board’s ground plane for proper
operation. Use abundant vias beneath the exposed pad
for maximum heat dissipation. Use abundant ground vias
between RF traces to minimize undesired coupling.
To minimize coupling between different sections of the
device, the ideal power-supply layout is a star configuration,
which has a large decoupling capacitor at the central
VCC node. The VCC traces branch out from this node,
with each trace going to separate VCC pins of the device.
Each VCC pin must have a bypass capacitor with low
impedance to ground at the frequency of interest. Do
not share ground vias among multiple connections to the
PCB ground plane.



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