HCPL-050L datasheet(4/11 Pages) HP

4 / 11 page

Solder Reflow Temperature Profile

Regulatory Information

The devices contained in this

data sheet have been approved by

the following organizations:

Approval under UL 1577,

Component Recognition

Program, File E55361.

CSA

Approval under CSA Component

Acceptance

Notice #5, File CA 88324.

IEC/EN/DINEN60747-5-2

Approved under :

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884

Teil 2):2003-01

Recommended Pb-Free IR Profile

TIME (SECONDS)

200

100

150

100

200

250

300

SEC.

50 SEC.

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

217 °C

RAMP-DOWN

6 °C/SEC. MAX.

RAMP-UP

3 °C/SEC. MAX.

150 - 200 °C

260 +0/-5 °C

t 25 °C to PEAK

60 to 150 SEC.

20-40 SEC.

TIME WITHIN 5 °C of ACTUAL

PEAK TEMPERATURE

PREHEAT

60 to 180 SEC.

Tsmax

Tsmin

TIME

NOTES:

THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.

Tsmax = 200 °C, Tsmin = 150 °C

HCPL-050L Datasheet(PDF) 4 Page - Agilent(Hewlett-Packard)

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