FN8219 Rev 3.00

Page 29 of 29

March 8, 2006

X98021

Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted

in the quality certifications found at www.intersil.com/en/support/qualandreliability.html

Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such

modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are

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For additional products, see www.intersil.com/en/products.html

© Copyright Intersil Americas LLC 2005-2006. All Rights Reserved.

All trademarks and registered trademarks are the property of their respective owners.

128-Lead Metric Quad Flat Pack (MQFP)

1

2.750±0.250

DIMENSIONS

MAX. 3.40

A

1

S/N

SYM

DIMENSION LIST ( FOOTPRINT: 3.200)

14.000±0.100

23.200±0.250

17.200±0.250

0.250~0.500

0°~7°

1.600 REF.

0.880±0.150

0.170±0.060

0.152±0.040

20.000±0.100

2

D

4

3

5

E

6

L

8

9

1

a

1

12

11

T

10

7

A2

L1

T1

E1

D1

A1

0.500 BASE

0.100

0.100

0.200±0.030

e

1

15

14

17

16

1

S/N

GENERAL TOLERANCE.

NOTES :

ddd

ccc

b1

1

0.220±0.050

b

13

2

1

4

3

6

2

7

5

OR CUTTING BURR.

DRAWING DOES NOT INCLUDE PLASTIC OR METAL PROTRUSION

EXCEPT EJECTION AND PIN 1 MARKING.

ALL MOLDED BODY SHARP CORNER RADII

UNLESS OTHERWISE SPECIFIED.

COMPLIANT TO JEDEC STANDARD:

TOP/BTM PACKAGE MISALIGNMENT ( X, Y ):

PACKAGE/LEADFRAME MISALIGNMENT ( X, Y ):

MATTE FINISH ON PACKAGE BODY SURFACE

Ra 0.8~2.0um

MS-022

MAX. R0.200

MAX. 0.127

MAX. 0.127

STANDOFF

SPECIFICATION

LEAD BASE METAL WIDTH

FOOT COPLANARITY

LEAD PITCH

FOOT POSITION

DESCRIPTION

DISTANCE

ANGLE

±0.100

±2.5°

LEAD TIP TO TIP

PKG THICKNESS

LEAD TIP TO TIP

PKG LENGTH

FRAME THICKNESS

LEAD LENGTH

FOOT ANGLE

FOOT LENGTH

PKG WIDTH

FRAME BASE METAL THICKNESS

LEAD WIDTH

OVERALL HEIGHT

REMARKS

SEATING

PLANE

14.000±0.100

ALL AROUND

1

A

12°

(D1)

Y

b

13.870±0.100

(4X)

C0.600X0.350

12° ALL AROUND

A

12.500 REF.

D

1

PIN 1

128

D1

ddd

C

DETAIL Y

b

e

L

L1

0.13~0.30

R0.13

MIN.

ALL AROUND

R0.25 TYP

0.200 MIN.

0 ° MIN.

SOLUTIONS IN SILICON

PACKAGE OUTLINE DRAWING

14 x 20 mm 128 LEAD MQFP (with or without Heat spreader)

DROP IN HEAT SPREADER

4 STAND POINTS EXPOSED

SECTION A-A

b1

Drawing #: MDP0055

Units: mm

Date: 09/26/05

Rev: 1

3.2 mm FOOTPRINT