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AFIC31025N Datasheet(PDF) 4 Page - NXP Semiconductors

Part # AFIC31025N
Description  RF LDMOS Integrated Power Amplifiers
PDF  12 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

AFIC31025N Datasheet(HTML) 4 Page - NXP Semiconductors

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RF Device Data
NXP Semiconductors
AFIC31025N AFIC31025GN
Table 5. Electrical Characteristics (TA =25C unless otherwise noted) (continued)
Characteristic
Symbol
Min
Typ
Max
Unit
Functional Tests (1,2) (In NXP Production Test Fixture, 50 ohm system) VDD =28 Vdc, IDQ1(A+B) =59 mA, IDQ2(A+B) = 157 mA,
Pout = 3.2 W Avg., f = 2690 MHz, Single--Carrier W--CDMA, IQ Magnitude Clipping, Input Signal PAR = 9.9 dB @ 0.01% Probability on
CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @ 5MHz Offset.
Power Gain
Gps
30.5
31.9
34.5
dB
Power Added Efficiency
PAE
18.0
19.7
—
%
Load Mismatch (In NXP Production Test Fixture, 50 ohm system) IDQ1(A+B) =59 mA, IDQ2(A+B) = 157 mA, f = 2600 MHz
VSWR 10:1 at 32 Vdc, 36 W CW Output Power
(3 dB Input Overdrive from 25 W CW Rated Power)
No Device Degradation
Table 6. Ordering Information
Device
Tape and Reel Information
Package
AFIC31025NR1
R1 Suffix = 500 Units, 44 mm Tape Width, 13--Reel
TO--270WB--17
AFIC31025GNR1
TO--270WBG--17
1. Part internally input and output matched.
2. Measurements made with device in straight lead configuration before any lead forming operation is applied. Lead forming is used for
gull wing (GN) parts.



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