Copyright

© ANPEC Electronics Corp.

Rev. A.5 - Apr., 2016

APA2018

www.anpec.com.tw

3

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability

Sym bol

Param eter

Rating

Unit

V

BAT

Supply Voltage (VBAT to GND)

-0.3 to 6

Input Voltage (IN+, IN- to GND)

-0.3 to V

Input Voltage (EN to GND)

-0.3 to V

V

T

J

Maximum Junction Temperature

150

T

STG

Storage Temperature Range

-65 to +150

T

SDR

Maximum Soldering Temperature Range, 10 Seconds

260

P

D

Pow er Dissipation

Internally Limited

W

Symbol

Parameter

Value

Unit

Thermal Resistance -Junction to Ambient

(Note2)

WLCSP1.5x2-12

TQFN4x4-16

97

60

θ

JC

Thermal Resistance -Junction to Case

(Note3)

WLCSP1.5x2-12

TQFN4x4-16

36

12

Note 2:

θ

Note 3: The case temperature is measured at the center of the PGND PIN on the underside of the WLCSP1.53x1.98-12 and TQFN4x4-

16 package.

Range

Symbol

Parameter

Min.

Max.

Unit

Supply Voltage

3

5.2

VIH

High Level Threshold Voltage

EN

1.3

-

VIL

Low Level Threshold Voltage

EN

-

0.6

Common Mode Input Voltage

1

V

Ambient Temperature Range

-40

85

Junction Temperature Range

-40

150

Speaker Resistance,

4

-

Ω

Recommended Operating Conditions