Copyright

© ANPEC Electronics Corp.

Rev. A.4 - May., 2017

www.anpec.com.tw

3

APA2621

Recommended Operating Conditions

Symbol

Parameter

Min.

Max.

Unit

Supply Voltage

4.5

22

SD

2.2

-

High Level Threshold Voltage

GAIN0, GAIN1, MONO

2.0

-

SD

-

0.8

Low Level Threshold Voltage

GAIN0, GAIN1, MONO

-

0.8

V

Ambient Temperature Range

-40

85

Junction Temperature Range

-40

125

Speaker Resistance

3.5

-

Ω

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance -Junction to Ambient

(Note 2)

TSSOP-28P

QFN4x4-28B

45

40

θ

JC

Thermal Resistance -Junction to Case

(Note 3)

TSSOP-28P

QFN4x4-28B

8

7

Note 2:

θ

of TSSOP-28P is soldered directly on the PCB.

Note 3: The case temperature is measured at the center of the exposed pad on the underside of the TSSOP-28P package.

Symbol

Parameter

Rating

Unit

Supply Voltage

-0.3 to 27

Input Voltage (SD, GAIN0 and GAIN1, MONO and FLAG)

PLIMIT, FREQ

-0.3 to 6.3

LINP, LINN, RINP, RINN

-0.3 to 6.3

V

Maximum Junction Temperature

150

Storage Temperature Range

-65 to +150

Maximum Soldering Temperature Range, 10 seconds

260

BTL: PVDD > 15V

4.8

BTL: PVDD < 15V

3.2

MONO mode

3.2

Ω

Power Dissipation

Internally Limited

W

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

(Over operating free-air temperature range unless otherwise noted.)