Copyright

© ANPEC Electronics Corp.

Rev. A.4 - Apr., 2018

www.anpec.com.tw

2

APX9322

S ymbol

Pa ram ete r

Ra tings

Unit

VCC P in Supp ly Voltage (V CC to S GND)

-0.3 to 1 8

V

UO , VO , WO Pin Maximum Output Peak Curre nt

4

A

UO , VO a nd WO Pins Output Vo ltag e

V PG ND-0 .3 to VCC

V

V

LA

LA P ins Inp ut Voltage (LA to S GND)

-0.3 to 7

V

SET P ins Inp ut Voltage (S ET to SGND)

-0.3 to 7

V

5VREG P in Output Source Curre nt

20

mA

SP1 P in Inp ut Voltage (SP 1 to SG ND)

-0.3 to 7

V

SP2 P in Inp ut Voltage (SP 2 to SG ND)

-0.3 to 7

V

MIN Pin Input Vo lta ge (MIN to SG ND)

-0.3 to 7

V

V

VSD

VSD Pin Input Vo lta ge (VSD to S GND)

-0.3 to 7

V

VLIM P in inpu t Volta ge (VLIM to SG ND)

-0.3 to 7

V

SEL Pins Input Vo ltag e(SE L to SGND)

-0.3 to 7

V

SO Pin O utput Voltage

-0.3 to 1 8

V

SO Pin Maximum Output Sink Current

10

mA

PWM P in In put Voltage (P WM to SGND)

-0 .3 to VCC

V

FR Pin Inpu t Volta ge (FR to SGND)

-0.3 to 7

V

T

J

Ma xim um Junction Tempera tu re

15 0

Sto rage Temperature

-65 to 150

Ma xim um Le ad So lderin g Tempe ratu re, 1 0 S econd s

26 0

Sym bol

P aram eter

Typical Value

Unit

Ther mal Re sistance-Junction to Ambi ent ( No te 3)

Q FN4 x4- 24A

50

Ther mal Re sistance-Junction to Ca se (Note 4)

Q FN4 x4- 24A

20

2.5

W

Note 2: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute ma-

ximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Note 3:

θ

JA

is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad

of QFN4x4-24A is soldered directly on the PCB.

Note 4: The case temperature is measured at the center on the top of the QFN4x4-24A package.