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ML63187 Datasheet(PDF) 7 Page - OKI electronic componets |
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ML63187 Datasheet(HTML) 7 Page - OKI electronic componets |
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7 / 36 page ![]() ¡ Semiconductor ML63187/63189B 7/35 PAD CONFIGURATION (ML63187) Pad Layout Chip size : 4.238 mm ¥ 4.914 mm Chip thickness : 350 mm (280 mm: available as required) Coordinate origin : center of chip Pad hole size : 100 mm ¥ 100 mm Pad size : 110 mm ¥ 110 mm Minimum pad pitch : 140 mm Note: The chip substrate voltage is VSS. Y X 27 SEG38 28 SEG39 SEG11 111 29 SEG40 SEG10 110 30 SEG41 SEG9 109 31 SEG42 SEG8 108 32 SEG43 SEG7 107 33 SEG44 SEG6 106 34 SEG45 SEG5 105 35 SEG46 SEG4 104 36 SEG47 SEG3 103 37 SEG48 SEG2 102 38 SEG49 SEG1 101 39 SEG50 SEG0 100 40 SEG51 COM8 99 41 SEG52 COM7 98 42 SEG53 COM6 97 43 SEG54 COM5 96 44 SEG55 COM4 95 45 SEG56 COM3 94 46 SEG57 COM2 93 47 SEG58 COM1 92 48 SEG59 PB.3 91 49 SEG60 PB.2 90 50 SEG61 PB.1 89 51 SEG62 PB.0 88 52 SEG63 PE.3 87 53 COM9 PE.2 86 54 COM10 PE.1 85 55 COM11 PE.0 84 56 COM12 VDDI 83 |
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