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AMC1302-Q1

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

AMC1302-Q1

UNIT

DWV (SOIC)

8 PINS

Junction-to-ambient thermal resistance

85.4

°C/W

26.8

°C/W

Junction-to-board thermal resistance

43.5

°C/W

Junction-to-top characterization parameter

4.8

°C/W

Junction-to-board characterization parameter

41.2

°C/W

N/A

°C/W

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

VALUE

UNIT

Maximum power dissipation (both sides)

VDD1 = VDD2 = 5.5 V

98.45

mW

VDD1 = VDD2 = 3.6 V

56.52

Maximum power dissipation (high-side supply)

VDD1 = 5.5 V

53.90

mW

VDD1 = 3.6 V

30.60

Maximum power dissipation (low-side supply)

VDD2 = 5.5 V

44.55

mW

VDD2 = 3.6 V

25.92