TL497AC, TL497AI, TL497AY

SWITCHING VOLTAGE REGULATORS

SLVS009C – JUNE 1976 – REVISED AUGUST 1995

4–3

POST OFFICE BOX 655303

TL497AY chip information

This chip, when properly assembled, displays characteristics similar to the TL497AC. Thermal compression or

ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

FREQ CONTROL

COMP INPUT

SUBSTRATE

CATHODE

CUR

LIM

SENS

BASE

DRIVE† BASE†

GND

V

CC

TL497AY

COL

OUT

EMIT

OUT

ANODE

(13)

(12)

(11)

(3)

(2)

(1)

(4)

(6)

(8)

(7)

(10)

(14)

(5)

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax= 150°C

TOLERANCES ARE

±10%

ALL DIMENSIONS ARE IN MILS

INHIBIT

68

115

† BASE (11) and BASE DRIVE (12) are used for device testing

only. They are not normally used in circuit applications of the

device.

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(14)

(10)

(11)

(12)

(13)