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AD5689R Datasheet(PDF) 26 Page - Analog Devices |
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AD5689R Datasheet(HTML) 26 Page - Analog Devices |
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26 / 28 page ![]() AD5689R/AD5687R Data Sheet Rev. B | Page 26 of 28 APPLICATIONS INFORMATION MICROPROCESSOR INTERFACING Microprocessor interfacing to the AD5689R/AD5687R is achieved via a serial bus using a standard protocol that is compatible with DSP processors and microcontrollers. The communications channel requires a 3-wire or 4-wire interface consisting of a clock signal, a data signal, and a synchronization signal. Each device requires a 24-bit data-word with data valid on the rising edge of SYNC. AD5689R/AD5687R TO ADSP-BF531 INTERFACE The SPI interface of the AD5689R/AD5687R is designed to be easily connected to industry-standard DSPs and microcontrollers. Figure 51 shows the AD5689R/AD5687R connected to an Analog Devices Blackfin® DSP. The Blackfin has an integrated SPI port that connects directly to the SPI pins of the AD5689R/AD5687R. ADSP-BF531 SYNC SPISELx SCLK SCK SDIN MOSI LDAC PF9 RESET PF8 AD5689R/ AD5687R Figure 51. ADSP-BF531 Interface to the AD5689R/AD5687R AD5689R/AD5687R TO SPORT INTERFACE The Analog Devices ADSP-BF527 has one SPORT serial port. Figure 52 shows how one SPORT interface can be used to control the AD5689R/AD5687R. ADSP-BF527 SYNC SPORT_TFS SCLK SPORT_TSCK SDIN SPORT_DTO LDAC GPIO0 RESET GPIO1 AD5689R/ AD5687R Figure 52. SPORT Interface to the AD5689R/AD5687R LAYOUT GUIDELINES In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. Design the PCB on which the AD5689R/ AD5687R are mounted so that the AD5689R/AD5687R lie on the analog plane. Provide the AD5689R/AD5687R with ample supply bypassing of 10 μF in parallel with 0.1 μF on each supply, located as close to the package as possible, ideally right up against the device. The 10 μF capacitor is of the tantalum bead type. Use a 0.1 μF capa- citor with low effective series resistance (ESR) and low effective series inductance (ESI), such as the common ceramic types, which provide a low impedance path to ground at high frequencies to handle transient currents due to internal logic switching. In systems where there are many devices on one board, it is often useful to provide some heat sinking capability to allow the power to dissipate easily. Each AD5689R or AD5687R has an exposed paddle beneath the device. Connect this paddle to the GND supply for the part. For optimum performance, use special considerations to design the motherboard and to mount the package. For enhanced thermal, electrical, and board level performance, solder the exposed paddle on the bottom of the package to the corresponding thermal land paddle on the PCB. Design thermal vias into the PCB land paddle area to further improve heat dissipation. The GND plane on the device can be increased (as shown in Figure 53) to provide a natural heat sinking effect. AD5689R/ AD5687R GND PLANE BOARD Figure 53. Paddle Connection to Board GALVANICALLY ISOLATED INTERFACE In many process control applications, it is necessary to provide an isolation barrier between the controller and the unit being controlled to protect and isolate the controlling circuitry from any hazardous common-mode voltages that may occur. The i Coupler® products from Analog Devices provide voltage isolation in excess of 2.5 kV. The serial loading structure of the AD5689R/ AD5687R makes these parts ideal for isolated interfaces because the number of interface lines is kept to a minimum. Figure 54 shows a 4-channel isolated interface to the AD5689R/AD5687R using an ADuM1400. For additional information, visit www.analog.com/icouplers. ENCODE SERIAL CLOCK IN CONTROLLER ADuM14001 SERIAL DATA OUT SYNC OUT LOAD DAC OUT DECODE TO SCLK TO SDIN TO SYNC TO LDAC VIA VOA ENCODE DECODE VIB VOB ENCODE DECODE VIC VOC ENCODE DECODE VID VOD 1ADDITIONAL PINS OMITTED FOR CLARITY. Figure 54. Isolated Interface |
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