AD5697R datasheet(26/27 Pages) AD

26 / 27 page

AD5697R

Data Sheet

Rev. B | Page 26 of 27

OUTLINE DIMENSIONS

Figure 53. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

3 mm × 3 mm Body, Very Very Thin Quad

(CP-16-22)

Dimensions shown in millimeters

Figure 54. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Resolution

Temperature Range

Accuracy

Reference

Temperature

Coefficient

(ppm/°C)

Package Description

Package

Option

Branding

AD5697RBCPZ-RL7

12 Bits

−40°C to +105°C

±1 LSB INL

±5 (max)

16-Lead LFCSP_WQ

CP-16-22

DKY

AD5697RBRUZ

12 Bits

−40°C to +105°C

±1 LSB INL

±5 (max)

16-Lead TSSOP

RU-16

AD5697RBRUZ-RL7

12 Bits

−40°C to +105°C

±1 LSB INL

±5 (max)

16-Lead TSSOP

RU-16

Z = RoHS Compliant Part.

3.10

3.00 SQ

2.90

0.30

0.23

0.18

1.75

1.60 SQ

1.45

0.50

BSC

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

0.50

0.40

0.30

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.80

0.75

0.70

COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

AD5697R Datasheet(PDF) 26 Page - Analog Devices

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