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AP65355 Datasheet(PDF) 2 Page - Diodes Incorporated

Part # AP65355
Description  650kHz ADAPTIVE COT STEP-DOWN CONVERTER
PDF  15 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AP65355 Datasheet(HTML) 2 Page - Diodes Incorporated

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AP65355
Document number: DS37875 Rev. 2 - 2
2 of 15
www.diodes.com
May 2017
© Diodes Incorporated
AP65355
Typical Applications Circuit
AP65355
L1
1.5
μH
R1
8.25k
Ω
R3
22.1k
Ω
C1
0.1µF
C3
44
μF
C2
20
μF
C4
8.2nF
ON
OFF
VIN
SS
EN
VREG5
SW
BST
FB
C5
1µF
PGND
INPUT
OUTPUT
VOUT
1.05V
VIN
12V
PG
PGOOD
VREG5
R2
100k
Ω
Figure 1 Typical Application Circuit
Pin Descriptions
Pin
Name
Package
Function
U-DFN3030-10
EN
1
Enable input. EN is a digital input that turns the regulator on or off. Drive EN high to turn on the regulator, drive
it low to turn off. EN can be safely connected to VIN directly for automatic startup.
FB
2
Feedback Input. FB senses the output voltage and regulates it. Drive FB with a resistive voltage divider
connected to it from the output voltage.
VREG5
3
Internal power supply output pin to connect an additional capacitor. Connect a
1μF (typical) capacitor as close
as possible to the VREG5 and PGND. This pin is not active when EN is low.
SS
4
Soft-start control input pin. SS controls the soft start period. Connect a capacitor from SS to PGND to set the
soft-start period.
SW
6,7
Power Switching Output. SW is the switching node that supplies power to the output. Connect the output LC
filter from SW to the output load. Note that a capacitor is required from SW to BST to power the high-side
switch.
BST
8
Bootstrap pin. A bootstrap capacitor is connected between the BST pin and SW pin. The voltage across the
bootstrap capacitor drives the internal high-side NMOS switch. A
0.1μF (typical) capacitor is required for proper
operation.
VIN
9,10
Supply input. A capacitor should be connected between the VIN pin and PGND pin to keep the DC input
voltage constant.
PG
5
Open drain power good output.
PGND
11 (Exposed
Pad)
Power ground and GND. Exposed pad must be connected to as large of PGND plane as possible for maximum
thermal performance.



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