MPM3530

– 55V, 3A, STEP-DOWN POWER MODULE

MPM3530 Rev. 1.0

www.MonolithicPower.com

3

9/21/2018

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© 2018 MPS. All Rights Reserved.

PIN FUNCTIONS

Pin #

Name

Description

1, 42 - 44

VIN

Input supply. VIN supplies power to all of the internal control circuitries and the VDD

regulator. Place a decoupling capacitor to ground close to VIN to minimize switching

spikes. Use wide traces to connect VIN.

2, 12 - 16,

30, 38, 41,

45, 46

PGND

Module power ground pin.

3

BST

Bootstrap. BST is the positive power supply for the internal floating high-side

MOSFET driver. Keep BST floating.

4 - 11

SW

Switch output. Keep SW floating.

17 - 28, 47

OUT

Module voltage output node. Use wide traces to connect OUT.

29

VDD

Power for internal MOSFET driver and BST charging circuit.

31

PG

Power good indication. Connect a resistor from PG to a pull-up power source if it is

being used.

32

SS

Soft start. Float SS for a default 1.2ms SS time. The SS time can be extended by

connecting an external capacitor between SS and AGND.

33 - 35

AGND

Ground for internal logic and signal circuit.

36

COMP

Compensation networks setting. Connect an external resistor series with a capacitor

between COMP and AGND. See the Application Information section on page 15 for

compensation network configuration details.

37

FB

Feedback. FB is the input to the PWM comparator. Connect an external resistor

divider between the output and AGND.

39

FREQ

Frequency set pin. Connect a resistor from FREQ to ground to set the switching

frequency. If an external SYNC clock is applied to FREQ, the converter follows this

SYNC clock frequency.

40

EN

Enable input. Pull EN below the specified threshold to shut down the chip. There is no

internal pull-up or pull-down circuit, so EN cannot be floated.

All other pins.................................... -0.3V to 6V

EN sink current ........................................150

μA

All other pins.................................... -0.3V to 4V

(2)

.....................................................................5W

Junction temperature ............................... 150°C

Lead temperature .................................... 260°C

Storage temperature.................. -65°C to 150°C

Recommended Operating Conditions

(3)

Thermal Resistance

QFN-47 (10mmx12mmx4mm)

EVM3530-RF-01A

JESD51-7

NOTES:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

ambient thermal resistance θ

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on EVM3530-RF-01A,4-layer PCB, 76mmx76mm.

5)

The value of θ

with other packages and cannot be used for design purposes.

These values were calculated in accordance with JESD51-7

and simulated on a specified JEDEC board. They do not

represent the performance obtained in an actual application.