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AL3353 Datasheet(PDF) 12 Page - Diodes Incorporated |
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AL3353 Datasheet(HTML) 12 Page - Diodes Incorporated |
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12 / 15 page ![]() AL3353 Figure 5. Typical Circuit Schematic of AL3353 Constant Output Voltage Application Application Information (Cont.) For the OCP setting, OVP setting, inductor design, power MOSFET selection and Schottky diode selection, the above configuration guides for LED driver are also applicable. Layout Guide The PCB layout is critical for the optimal performance of the boost converter design. A good PCB layout is fundamental to correct operation and high performance of the converter. And the EMI performance is especially dependent on the PCB layout. So, the following important guidelines should be followed: 1. The traces of the power loops should be wide and short, and the power components should be placed close together to make the loop area as small as possible. There are two high-current power loops in the converter. One is the high-current input loop, and the other is the high- current output loop. The high-current input loop goes from the positive terminal of the CIN to the inductor, to the MOSFET, then to the current-sense resistor, and to the negative terminal of CIN. The high-current output loop goes from the positive terminal of the CIN to the inductor, to the diode, to the positive terminal of the COUT, reconnecting between the COUT and the CIN ground terminals. L1 VIN Q1 D2 COUT VOUT CIN Switch Node Figure 6. The Power Loops of a Boost Converter 2. A decoupling capacitor of the VIN pin is recommended and it should be placed as close as possible to the pin, to reduce the noise on the power source for the internal logic circuit. 3. To keep the gate signal clean, the gate driving trace should be placed away from the inductor, since the alternating magnetic field is the primary noise source in a switching converter 4. For the OVP resistor divider, the both resistors should be placed close to the IC, and the divider should be grounded close to the IC ground. 5. For the compensation capacitor, it should be placed as close as possible to the COMP pin. 6. Copper area of the power loop, especially around the switching node should be as big as possible for good thermal performance. AL3353 Document number: DS41487 Rev. 2 - 2 12 of 15 www.diodes.com February 2019 © Diodes Incorporated |
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