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BME680 Datasheet(PDF) 44 Page - Bosch Sensortec GmbH |
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BME680 Datasheet(HTML) 44 Page - Bosch Sensortec GmbH |
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44 / 50 page ![]() Bosch Sensortec | BME680 Datasheet 44 | 50 Modifications reserved |Data subject not change without notice | Printed in Germany Document number: BST-BME680-DS001-00 Revision_1.0_072017 7.4 Landing pattern recommendation For the design of the landing pattern, the dimensions shown in Picture 14: Recommended landing pattern (top view; dimensions are in milli-meters) are recommended. It is important to note that areas marked in red are exposed PCB metal pads. In case of a solder mask defined (SMD) PCB process, the land dimensions should be defined by solder mask openings. The underlying metal pads are larger than these openings. In case of a non-solder mask defined (NSMD) PCB process, the land dimensions should be defined in the metal layer. The mask openings are larger than these metal pads. 1 2 4 3 8 7 5 6 Soldier stop Landing pattern 1.50 3.00 0.40 0.60 Picture 14: Recommended landing pattern (top view; dimensions are in milli-meters) |
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