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MSM6654 Datasheet(PDF) 33 Page - OKI electronic componets |
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MSM6654 Datasheet(HTML) 33 Page - OKI electronic componets |
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33 / 45 page ![]() 33/45 ¡ Semiconductor MSM6650 Family FEDL6650-03 Symbol Type Description AGND — Analog ground pin. MCK O Main clock output pin. Use MCK as a connection pin for the MSC1192, etc. When the IC is in standby status, MCK is held high. CPU I CPU Mode. Set to "H" level to select Microcontroller Interface Mode. SERIAL I Serial/Parallel Interface Select. This input selects either the parallel or the serial input interface. The serial input interface is selected with a high level; the parallel input interface is selected with a low level. CE O Chip Enable. CE is a timing output pin to control read of external memory. This pin outputs when RCS is at the "L" level. This pin goes high impedance when RCS is at the "H" level. RCS I Read Chip Select. The data bits D0-D7 are internally pulled down when RCS is high. DGND — Digital ground pin. AVDD — Analog power pin. Insert a 0.1 mF or more bypass capacitor between this pin and AGND. DVDD — Digital power pin. Insert a 0.1 mF or more bypass capacitor between this pin and DGND. D0 - D7 I External Memory Data Bus. Data is input when RCS is low. When RCS is high, these pins become low due to internal pull-down resistors. RA0 - RA22 O External Memory Address. These are address pins for an external memory output when RCS is low. These pins become high impedance status if RCS is in "H" level. TEST1, 2 I Test. Set these pins to "H" level. IBUSY O Outputs a "L" level during playback or when AOUT is at 1/2 VDD (except standby conversion) STANDBY O Outputs a "L" level during which the device is oscillating. Pin 6 (60) 12 (2) 16 (6) 17 (7) 30 (20) 31 (21) 7 (61) 8 (62) 9 (63) 32, 34-40 (22, 24-30) 41-63 (31-40, 42-54) 15, 64 (5, 55) 18 (8) 20 (10) |
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