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MSM6654 Datasheet(PDF) 40 Page - OKI electronic componets |
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MSM6654 Datasheet(HTML) 40 Page - OKI electronic componets |
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40 / 45 page ![]() 40/45 ¡ Semiconductor MSM6650 Family FEDL6650-03 (Unit : mm) PACKAGE DIMENSIONS DIP18-P-300-2.54 Package material Lead frame material Pin treatment Package weight (g) Oki Electric Industry Co., Ltd. Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5 mm) 1.30 TYP. 2/Dec. 11, 1996 |
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