AW8110CSR datasheet(3/14 Pages) AWINIC

3 / 14 page

AW8110 Datasheet

June 2010 V1.3

Page 3 of 14

Ordering Information

Part Number

Temperature

Package

Marking

Packing Type

AW8110CSR

-40℃～85℃

CSP9

8110

3000 units/Tape

and Reel

Absolute Maximum Ratings(1)

Parameter

Unit

Supply voltage VDD

-0.3V to 6V

Input Voltage

-0.3V to VDD+0.3V

Package Thermal Resistance θJA(2)

90 /W

℃

Operating free-air temperature

-40

to 85

℃℃

Maximum Junction Temperature TJMAX

125℃

Storage Temperature Range TSTG

-65

to 150

℃℃

Lead Temperature (Soldering 10 Seconds)

260℃

ESD Rating(3)

HBM(human body model)

±8KV

Latch-up

Test Condition :JEDEC STANDARD NO.78B DECEMBER 2008

+IT:450mA

-IT:-450mA

note1:

Stresses beyond those listed under "abso-

lute maximum ratings" may cause permanent damage

to the device. These are stress ratings only and func-

tional operation of the device at these or any other

conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure

to absolute-maximum-rated conditions for extended

periods may affect device reliability.

note2:

For the 9-Pin Flip-Chip CSP package, the

θJA is highly dependent of the PCB Heatsink area. For

example,

θJA can equal 195°C/W with 50 mm2 total

area and also 135°C/W with 500 mm2. When using

ground and power planes, the value is around 90°C/W,

as specified in table

note3:

The human body model is a 100pF capacitor

discharged through a 1.5kΩ resistor into each pin. Test

method: MIL-STD-883G Method 3015.7.

AW8110CSR Datasheet(PDF) 3 Page - Shanghai awinic technology co.,ltd

AW8110CSR Datasheet(HTML) 3 Page - Shanghai awinic technology co.,ltd

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14

Datasheet Download

Link URL