TDA2003

10W CAR RADIO AUDIO AMPLIFIER

www.artschip.com

7

Figure 20. Output power and drain current vs. case temperature (RL=4Ω)

Figure 21. Output power and drain current vs. case temperature (RL=2Ω)

PRATICAL CONSIDERATION

Printed circuit board

The layout shown in fig. 17 is recommended. If different layouts

are used, the ground points of input 1 and input 2 must be well

decoupled from the ground of the output through which a rather

high current flows.

Assembly suggestion

No electrical insulation is required between the package and the

heat-sink. Pin length should be as short as possible. The

soldering temperature must not exceed 260℃ for 12 seconds.

Application suggestions

The recommended component values are those shown in the

application circuits of fig. 16.

Different values can be used. The following table is intended to

aid the car-radio designer.

Component

Recommended

value

Purpose

Large than

Recommended value

Smaller than

Recommended value C1

C1

2.2µF

Input DC

decoupling

Noise at switch-on, switch-off

C2

470µF

Ripple rejection

Degradation of SVR

C3

0.1µF

Supply bypassing

Danger of oscillation

C4

1000µF

Output coupling to load

Higher low frequency cutoff

C5

0.1µF

Frequency stability

Danger of oscillation at high

frequencies with inductive

loads

Upper frequency cutoff

Lower bandwidth

Larger bandwidth

R1

(Gv-1)·R2

Setting of gain

Increase of drain current

R2

2.2Ω

Setting of gain and SVR

Degradation of SVR

R3

1Ω

Frequency stability

Danger of oscillation at

high frequencies with

inductive loads

≈20R2

Upper frequency cutoff

Poor high frequency

attenuation

Danger of oscillation