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AM5728 Datasheet(PDF) 190 Page - Texas Instruments

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Part # AM5728
Description  Sitara Processors Silicon Revision 2.0
PDF  415 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

AM5728 Datasheet(HTML) 190 Page - Texas Instruments

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AM5729, AM5728, AM5726
SPRS953F – DECEMBER 2015 – REVISED MAY 2019
www.ti.com
Submit Documentation Feedback
Product Folder Links: AM5729 AM5728 AM5726
Specifications
Copyright © 2015–2019, Texas Instruments Incorporated
Table 5-17. Dual Voltage LVCMOS DC Electrical Characteristics (continued)
PARAMETER
MIN
NOM
MAX
UNIT
IIN with pullup
enabled
Input current at each I/O pin with weak pullup
enabled measured when PAD = 0
10
100
290
µA
CPAD
Pad capacitance (including package capacitance)
4
pF
ZO
Output impedance (drive strength)
40
Ω
(1) VDDS stands for corresponding power supply. For more information on the power supply name and the corresponding ball, see Table 4-
2, POWER [11] column.
5.7.11 SATAPHY DC Electrical Characteristics
NOTE
The SATA module is compliant with the electrical parameters specified in the SATA-IO SATA
Specification, Revision 3.2, August 7, 2013.
5.7.12 PCIEPHY DC Electrical Characteristics
NOTE
The PCIe interfaces are compliant with the electrical parameters specified in PCI Express
Base Specification Revision 3.0.
5.8
Thermal Characteristics
For reliability and operability concerns, the maximum junction temperature of the Device has to be at or
below the TJ value identified in Table 5-4, Recommended Operating Conditions.
It is recommended to perform thermal simulations at the system level with the worst case device power
consumption.
5.8.1
Package Thermal Characteristics
Table 5-18 provides the thermal resistance characteristics for the package used on this device.
NOTE
Power dissipation of 1.5 W and an ambient temperature of 85ºC is assumed for ABC
package.
Table 5-18. Thermal Resistance Characteristics (ABC Package)
NO.
PARAMET
ER
DESCRIPTION
°C/W(1)
AIR FLOW (m/s)(2)
T1
RΘJC
Junction-to-case
0.82
N/A
T2
RΘJB
Junction-to-board
3.78
N/A
T3
RΘJA
Junction-to-free air
11.1
0
T4
Junction-to-moving air
8.8
1
T5
8.0
2
T6
7.5
3
T7
ΨJT
Junction-to-package top
0.62
0
T8
0.66
1
T9
0.66
2
T10
0.66
3



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