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AM5728 Datasheet(PDF) 187 Page - Texas Instruments

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Part # AM5728
Description  Sitara Processors Silicon Revision 2.0
PDF  415 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

AM5728 Datasheet(HTML) 187 Page - Texas Instruments

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AM5729, AM5728, AM5726
www.ti.com
SPRS953F – DECEMBER 2015 – REVISED MAY 2019
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Product Folder Links: AM5729 AM5728 AM5726
Specifications
Copyright © 2015–2019, Texas Instruments Incorporated
(1) The IHHV1833 buffer exists in the dual-voltage IO logic that can be powered by either 1.8V or 3.3V provided by vddshv3. However, the
vddshv3 supply is only used for input protection circuitry, not for logic functionality. The logic in this buffer operates entirely on the
vdds18v supply. Therefore, IHHV control is asserted whenever the input is low and vdds18v is valid.
5.7.6
LVCMOS OSC Buffers DC Electrical Characteristics
Table 5-14 summarizes the DC electrical characteristics for LVCMOS OSC Buffers.
Table 5-14. LVCMOS OSC Buffers DC Electrical Characteristics
PARAMETER
MIN
NOM
MAX
UNIT
Signal Names in MUXMODE 0: rtc_osc_xi_clkin32 / rtc_osc_xo;
Balls: AE14 / AD14;
1.8-V Mode
VIH
Input high-level threshold
0.65 *
VDDS
V
VIL
Input low-level threshold
0.35 *
VDDS
V
VHYS
Input hysteresis voltage
150
mV
CPAD
Pad capacitance (including package capacitance)
3
pF
(1) VDDS stands for corresponding power supply (that is vdda_rtc). For more information on the power supply name and the corresponding
ball, see Table 4-2, POWER [11] column.
5.7.7
BC1833IHHV Buffers DC Electrical Characteristics
Table 5-15 summarizes the DC electrical characteristics for BC1833IHHV Buffers.
Table 5-15. BC1833IHHV Buffers DC Electrical Characteristics
PARAMETER
MIN
NOM
MAX
UNIT
Signal Names in MUXMODE 0: on_off;
Balls: Y11;
1.8-V Mode
VOH
Output high-level threshold (IOH = 2 mA)
VDDS-
0.45
V
VOL
Output low-level threshold (IOL = 2 mA)
0.45
V
IDRIVE
Pin Drive strength at PAD Voltage = 0.45V or VDDS-0.45V
6
mA
IIN
Input current at each I/O pin
6
12
µA
IOZ
IOZ(IPAD Current) for BIDI cell. This current is contributed by
the tristated driver leakage + input current of the Rx + weak
pullup/pulldown leakage. PAD is swept from 0 to VDDS and
the Max(I(PAD)) is measured and is reported as IOZ
6
µA
CPAD
Pad capacitance (including package capacitance)
4
pF
3.3-V Mode
VOH
Output high-level threshold (IOH =100 µA)
VDDS-0.2
V
VOL
Output low-level threshold (IOL = 100 µA)
0.2
V
IDRIVE
Pin Drive strength at PAD Voltage = 0.45V or VDDS-0.45V
6
mA
IIN
Input current at each I/O pin
60
µA
IOZ
IOZ(IPAD Current) for BIDI cell. This current is contributed by
the tristated driver leakage + input current of the Rx + weak
pullup/pulldown leakage. PAD is swept from 0 to VDDS and
the Max(I(PAD)) is measured and is reported as IOZ
60
µA
CPAD
Pad capacitance (including package capacitance)
4
pF



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