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AM5728 Datasheet(PDF) 191 Page - Texas Instruments |
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AM5728 Datasheet(HTML) 191 Page - Texas Instruments |
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191 / 415 page ![]() 191 AM5729, AM5728, AM5726 www.ti.com SPRS953F – DECEMBER 2015 – REVISED MAY 2019 Submit Documentation Feedback Product Folder Links: AM5729 AM5728 AM5726 Specifications Copyright © 2015–2019, Texas Instruments Incorporated Table 5-18. Thermal Resistance Characteristics (ABC Package) (continued) NO. PARAMET ER DESCRIPTION °C/W(1) AIR FLOW (m/s)(2) T11 ΨJB Junction-to-board 3.43 0 T12 3.22 1 T13 3.12 2 T14 3.04 3 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: – JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) – JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages – JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) – JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages – JESD51-9, Test Boards for Area Array Surface Mount Packages (2) m/s = meters per second |
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