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ADUCM331WFS Datasheet(PDF) 12 Page - Analog Devices |
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ADUCM331WFS Datasheet(HTML) 12 Page - Analog Devices |
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12 / 17 page ![]() ADuCM330WFS/ADuCM331WFS Data Sheet Rev. A | Page 12 of 17 ABSOLUTE MAXIMUM RATINGS The ADuCM330WFS/ADuCM331WFS operate directly from the 12 V battery supply and is fully specified over the −40°C to +115°C temperature range, unless otherwise noted. Table 2. Parameter Rating AGND to DGND to VSS to IO_VSS −0.3 V to +0.3 V VBAT to AGND −22 V to +40 V VDD to VSS −0.3 V to +40 V LIN to IO_VSS −18 V to +40 V Digital Input and Output Voltage to DGND −0.3 V to DVDD33 + 0.3 V ADC Inputs to AGND −0.3 V to AVDD18 + 0.3 V ESD Rating Human Body Model (HBM) Rating1 HBM-ADI0082 All Pins Except LIN and VBAT ±2.0 kV LIN ±6 kV VBAT ±4 kV IEC 61000-4-2 LIN and VBAT ±8 kV Storage Temperature Range −55°C to +150°C Junction Temperature Transient 150°C Continuous 130°C Lead Temperature Soldering Reflow2 260°C Lifetime3 Normal Mode At −40°C 480 Hours At 23°C 1600 Hours At 60°C 5200 Hours At 85°C 640 Hours At 105°C 80 Hours Standby Mode At −40°C 12,648 Hours At 25°C 60,000 Hours At 50°C 50,000 Hours 1 Based on ANSI/ESD STM5.1-2007. 2 JEDEC Standard J-STD-020. 3 Using an activation energy of 0.7 eV, verified using high temperature operating life (HTOL) at 125°C for 1000 hours. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Close attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 3. Thermal Resistance Package Type θJA θJC Unit CP-32-151 40 15 °C/W 1 Test Condition 1: thermal impedance simulated values are based on JEDEC 4-layer test board. ESD CAUTION |
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