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LSF0108PW Datasheet(PDF) 6 Page - Texas Instruments |
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LSF0108PW Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 40 page ![]() 6 LSF0101, LSF0102, LSF0108 SDLS966H – DECEMBER 2013 – REVISED JUNE 2019 www.ti.com Product Folder Links: LSF0101 LSF0102 LSF0108 Submit Documentation Feedback Copyright © 2013–2019, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Advance Information 6.4 Thermal Information: LSF0101, LSF0108 THERMAL METRIC(1) LSF0101 LSF0108 UNIT DTQ (X2SON)(2) DRY (SON) RKS (VQFN) PW (TSSOP) 6 PINS 6 PINS 20 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 294.4 407.0 49.3 106.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 188.9 285.2 45.9 41.0 °C/W RθJB Junction-to-board thermal resistance 216.8 271.6 20.6 57.6 °C/W ψJT Junction-to-top characterization parameter 26.5 113.5 2.5 4.2 °C/W ψJB Junction-to-board characterization parameter 216.0 271.0 20.6 47.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a 3.4 n/a °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.5 Thermal Information: LSF0102 THERMAL METRIC(1) LSF0102 UNIT DCU (US8) DCT (SM8) DQE (X2SON) YZT (DSBGA) 8 PINS 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 210.1 189.6 246.5 125.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 89.1 119.6 149.1 1.0 °C/W RθJB Junction-to-board thermal resistance 88.8 102.1 100.0 62.7 °C/W ψJT Junction-to-top characterization parameter 8.3 44.5 17.1 3.4 °C/W ψJB Junction-to-board characterization parameter 88.4 101.0 99.8 62.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a °C/W (1) All typical values are at TA = 25°C. (2) Measured by the voltage drop between the A and B pins at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) pins. 6.6 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT VIK II = –18 mA, VEN = 0 –1.2 V IIH VI = 5 V VEN = 0 5.0 µA ICC Vref_B = VEN = 5.5 V, Vref_A = 4.5 V or 1 V, IO = 0, VI = VCC or GND 1 µA CI(ref_A/B/EN) VI = 3 V or 0 11 pF Cio(off) VO = 3 V or 0, VEN = 0 4.0 6.0 pF Cio(on) VO = 3 V or 0, VEN = 3 V 10.5 12.5 pF ron (2) VI = 0, IO = 64 mA Vref_A = 3.3 V; Vref_B = VEN = 5 V 8.0 Ω Vref_A = 1.8 V; Vref_B = VEN = 5 V 9.0 Vref_A = 1.0 V; Vref_B = VEN = 5 V 10 VI = 0, IO = 32 mA Vref_A = 1.8 V; Vref_B = VEN = 5 V 10 Ω Vref_A = 2.5 V; Vref_B = VEN = 5 V 15 VI = 1.8 V, IO = 15 mA Vref_A = 3.3 V; Vref_B = VEN = 5 V 9.0 Ω VI = 1.0 V, IO = 10 mA Vref_A = 1.8 V; Vref_B = VEN = 3.3 V 18 Ω VI = 0 V, IO = 10 mA Vref_A = 1.0 V; Vref_B = VEN = 3.3 V 20 Ω VI = 0 V, IO = 10 mA Vref_A = 1.0 V; Vref_B = VEN = 1.8 V 30 Ω |
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