TSB17BA1

IEEE STD 1394b SINGLEPORT CABLE TRANSCEIVER

SLLS568C − JANUARY 2004 − REVISED MARCH 2004

7

POST OFFICE BOX 655303

electrical characteristics over recommended ranges of operating conditions (unless otherwise

noted)

driver

PARAMETER

TEST CONDITIONS

TYP

UNIT

VOD

Differential output voltage (BETA)

705

mV

VOD

Differential output voltage (UTP5)

500

mV

IBETA

Beta drive current, BETA_OUTP, BETA_OUTN

Drivers enabled

12.5

mA

IUTP5

UTP5 drive current, UTP5_OUTP, UTP5_OUTN

Drivers enabled

10

mA

receiver

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ZID

Differential impedance

Drivers disabled

4

7

k

Ω

ZID

Differential impedance

Drivers disabled

4

pF

ZIC

Common-mode impedance

Drivers disabled

20

k

Ω

ZIC

Common-mode impedance

Drivers disabled

24

pF

device

PARAMETER

TEST CONDITIONS

TYP

UNIT

3.3-V supply current†

4

IDDSTATIC

VDDCORE supply current†

No signals to driver inputs

4

mA

IDDSTATIC

3.3-V supply current‡

No signals to driver inputs

7.5

mA

3.3-V supply current†

6

IDDDYN

VDDCORE supply current†

Normal operation

30

mA

IDDDYN

3.3-V supply current‡

Normal operation

50

mA

† Measured with internal regulator off, 1.8-V supply current from external source

‡ Measured with internal regulator on

thermal characteristics

PARAMETER

TEST CONDITIONS

TYP

UNIT

RθJA

Junction-to-free-air thermal resistance

Board mounted, no air flow, high conductivity TI-recommended test

board, chip soldered or greased to thermal land with 2-oz copper (high-K

91.5

°C/W

RθJC Junction-to-case thermal resistance

board, chip soldered or greased to thermal land with 2-oz copper (high-K

board)

41.2

°C/W

RθJA

Junction-to-free-air thermal resistance

Board mounted, no air flow, high conductivity JEDEC test board with 1-oz

150.7

°C/W

RθJC Junction-to-case thermal resistance

Board mounted, no air flow, high conductivity JEDEC test board with 1-oz

copper (low-K board)

41.2

°C/W