ADS8381

SLAS364D − APRIL 2002 − REVISED FEBRUARY 2005

www.ti.com

2

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during

storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

MODEL

MAXIMUM

INTEGRAL

LINEARITY

(LSB)

MAXIMUM

DIFFERENTIAL

LINEARITY

(LSB)

NO

MISSING

CODES

RESOLU-

TION (BIT)

PACKAGE

TYPE

PACKAGE

DESIGNATOR

TEMPER-

ATURE

RANGE

ORDERING

INFORMATION

TRANS-

PORT

MEDIA

QUANTITY

ADS8381I

±6

−2/3

17

48 Pin

PFB

−40

°C to

ADS8381IPFBT

Tape and

reel 250

ADS8381I

±6

−2/3

17

48 Pin

TQFP

PFB

−40 C to

85

°C

ADS8381IPFBR

Tape and

reel 1000

ADS8381IB

±5

−1/2

18

48 Pin

PFB

−40

°C to

ADS8381IBPFBT

Tape and

reel 250

ADS8381IB

±5

−1/2

18

48 Pin

TQFP

PFB

−40 C to

85

°C

ADS8381IBPFBR

Tape and

reel 1000

NOTE: For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website

at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNIT

Voltage

+IN to AGND

−0.4 V to +VA + 0.1 V

Voltage

−IN to AGND

−0.4 V to 0.5 V

+VA to AGND

−0.3 V to 7 V

Voltage range

+VBD to BDGND

−0.3 V to 7 V

Voltage range

+VA to +VBD

−0.3 V to 2.55 V

Digital input voltage to BDGND

−0.3 V to +VBD + 0.3 V

Digital output voltage to BDGND

−0.3 V to +VBD + 0.3 V

Operating free-air temperature range, TA

−40

°C to 85°C

Storage temperature range, Tstg

−65

°C to 150°C

Junction temperature (TJ max)

150

°C

TQFP package

Power dissipation

(TJMax − TA)/θJA

TQFP package

θJA thermal impedance

86

°C/W

Lead temperature, soldering

Vapor phase (60 sec)

215

°C

Lead temperature, soldering

Infrared (15 sec)

220

°C

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.