Temperature Profile for IR Reflow Soldering(Pb-Free)

Note:

1.Preheating:150~180℃, Time:60~90sec.

2.Peak Temp.:245±5℃, Duration:5±0.5sec.

3. Cooling Speed: 2~10℃/sec.

Resistance to Soldering Heat Test Conditions

Temp.:260±5℃

Time:10±1sec

Packaging SPEC.(REEL)

Package Type

Units

n

o

i

s

n

e

m

i

D

(unit：mm )

Units/Reel Reels/Inner Box Units/Inner Box Inner Boxes/Outer Box Units/Outer Box

Reel

Inner Box

Outer Box

SOT-23-5/6

3,000

10

30,000

4

120,000

210×205×205

445×230×435

3

2018. 12. 27

8/8

Revision No : 0

FC3470