µPD75P316A

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CONTENTS

1.

PIN FUNCTIONS ......................................................................................................................................... 5

1.1

PORT PINS ........................................................................................................................................................... 5

1.2

OTHER PINS ......................................................................................................................................................... 7

1.3

PIN INPUT/OUTPUT CIRCUITS ......................................................................................................................... 9

1.4

CAUTION ON USING P00/INT4 PIN AND RESET PIN .................................................................................. 11

2.

DIFFERENCES BETWEEN PRODUCTS IN SERIES ............................................................................... 11

3.

DATA MEMORY (RAM) ............................................................................................................................ 13

4.

PROGRAM MEMORY WRITE AND VERIFY ........................................................................................... 15

4.1

PROGRAM MEMORY WRITE/VERIFY OPERATING MODES ....................................................................... 15

4.2

PROGRAM MEMORY WRITING PROCEDURE ............................................................................................... 16

4.3

PROGRAM MEMORY READING PROCEDURE ............................................................................................... 17

4.4

ERASURE METHOD .......................................................................................................................................... 18

5.

ELECTRICAL SPECIFICATIONS ............................................................................................................... 19

6.

PACKAGE INFORMATION ....................................................................................................................... 35

7.

RECOMMENDED SOLDERING CONDITIONS ....................................................................................... 37

APPENDIX A. DEVELOPMENT TOOLS ......................................................................................................... 38

APPENDIX B. RELATED DOCUMENTS ........................................................................................................ 39

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